Do you require an off-the-shelf heat sink design rather than a fully custom design?We have the perfect heat sink assembly solution for you.
By combining generative design with standard shapes, Diabatix’s ColdStream can find the best heat sink for any operating temperature in any application.
Leverage generative design to explore, test, and effectively validate your state-of-the-art heat sinks with minimal human effort.
Whether for automotive, high-performance computing, LED cooling, or any other product, generative design can help you speed up your design process while pushing the boundaries of thermal design to new limits.
Take full control of your design process thanks to our advanced algorithms, combined with unlimited computing power.
Making the process exponentially faster.Configure the design parameters and their appropriate ranges automatically with geometry and case-specific settings defined by you.
The method is based on setting up and calculating a thermal network model every iteration of the optimization loop.
Combine the best of two worlds by constructing the network model via a full CFD analysis.
Run a full CFD analysis every iteration of the optimization loop to get maximal accuracy during your optimization.
To effectively dissipate heat, it is important to understand the basic principles and considerations for designing a heat sink.
Firstly, heat sinks should have pins/fins to increase surface area for better heat transfer through convection and radiation.
Secondly, high thermal conductivity materials like aluminum and copper are ideal for heat sinks. They efficiently transfer heat from the component to the surface for effective dissipation.
Lastly, heat sink design relies on proper airflow to dissipate heat. Optimal cooling efficiency is achieved by considering airflow patterns and the heat sink's placement and orientation. Natural convection or forced convection with fans can ensure unobstructed airflow.
Engineers must consider surface area, thermal conductivity, and airflow when designing heat sinks for optimal operating temperatures of electronic components. Fins can increase surface area, high thermal conductivity materials can be used, and airflow patterns must be considered. This ensures safe and effective operation.