Find the best heat sink design for your application using generative design and AI

Do you require an off-the-shelf heat sink design rather than a fully custom design?We have the perfect heat sink assembly solution for you.

By combining generative design with standard shapes, Diabatix’s ColdStream can find the best heat sink for any operating temperature in any application.

Leverage generative design to explore, test, and effectively validate your state-of-the-art heat sinks with minimal human effort.

Whether for automotive, high-performance computing, LED cooling, or any other product, generative design can help you speed up your design process while pushing the boundaries of thermal design to new limits.

heat sink design for all heat transfer methods for excellent thermal conductivity performance

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active heat sinks for high thermal conductivity and heat sink attachment methods for thermal performance with Diabatix

Explore the best choices for heat sink shape, material, and manufacturing

Studying the influence of different heat sink manufacturing processes and techniques, such as Forging or Extrusion, on your heat sinks performance while selecting the best heat sink material simultaneously has become a reality.

By relying on the most advanced algorithms that learn to map the inputs of active and passive heat exchangers and sinks to the desired performance target, we can select the best-performing heat sinks from within your range of interest.

Designing multiple, electrical component electrical components together, selecting the best materials, and choosing manufacturing techniques can all be done simultaneously.

With every design iteration, we get one step closer to finding your optimal shapes.

Benefit from advanced heat sink technologies for any budget

Take full control of your design process thanks to our advanced algorithms, combined with unlimited computing power.

Making the process exponentially faster.Configure the design parameters and their appropriate ranges automatically with geometry and case-specific settings defined by you.

Thermal network

Very fast (< 2 hours)
Only correlations

The method is based on setting up and calculating a thermal network model every iteration of the optimization loop.

CFD reinforced

Reasonably fast (< 2 days)
CFD + correlations

Combine the best of two worlds by constructing the network model via a full CFD analysis.

CFD

Accurate
Only CFD

Run a full CFD analysis every iteration of the optimization loop to get maximal accuracy during your optimization.

Read more about our thermal network and CFD technology

Heat sinks FAQs

What is an optimal heat sink design?

Heat sinks are used to cool electronic components by dissipating heat away from them. To design an optimal heat sink, key factors such as maximizing heat transfer efficiency and minimizing ambient air temperature should be considered before constructing the heat sink.

‍Thermal conductivity: Heat sinks require materials with high thermal conductivity, such as aluminum and copper alloys.

‍Surface area: The larger the surface area of the heat sink, the better it can dissipate heat. This is typically achieved by incorporating fins, which increase the effective surface area for heat transfer.Fin design: Fins must be thin and spaced properly for effective heat dissipation. Different fin shapes can be used based on the application's needs.

‍Heat sink base: The heat sink should have good contact with the cooling component. A flat, smooth base helps ensure efficient thermal contact, reducing thermal resistance.

‍Airflow: To remove heat from a heat sink, airflow should be unobstructed through natural or forced convection. Position the heat sink to optimize heat dissipation with the direction of airflow.

‍Thermal interface material (TIM): The TIM is applied between the heat sink and the component to fill any microscopic gaps and improve thermal conductivity. Proper selection and application of high-quality TIM can significantly enhance heat transfer efficiency.

‍System integration: Consider system requirements like space, weight, and compatibility when designing a heat sink. Integration into the system should be seamless.

‍Optimization and analysis: Engineers can improve cooling by using thermal simulations like CFD analysis to optimize heat sink design. By assessing factors such as fin density, shape, and airflow patterns, they can achieve superior cooling results.

Efficient heat dissipation is key to maintaining optimal performance and longevity of electronic systems. By designing an optimal heat sink, thermal energy can be effectively dissipated to keep components within their safe operating range.

What are heat sink design basics?

To effectively dissipate heat, it is important to understand the basic principles and considerations for designing a heat sink.

Firstly, heat sinks should have pins/fins to increase surface area for better heat transfer through convection and radiation.

Secondly, high thermal conductivity materials like aluminum and copper are ideal for heat sinks. They efficiently transfer heat from the component to the surface for effective dissipation.

Lastly, heat sink design relies on proper airflow to dissipate heat. Optimal cooling efficiency is achieved by considering airflow patterns and the heat sink's placement and orientation. Natural convection or forced convection with fans can ensure unobstructed airflow.

Engineers must consider surface area, thermal conductivity, and airflow when designing heat sinks for optimal operating temperatures of electronic components. Fins can increase surface area, high thermal conductivity materials can be used, and airflow patterns must be considered. This ensures safe and effective operation.

Find the best heat sink design for your application using generative design and AI

Explore the best choices for heat sink shape, material, and manufacturing

Find your optimal pin/fin heat sink: Power inverter liquid cooler video explainer

Combine 20 heat sink objectives and constraints to optimize your product