Find out how the collaboration of 3D Systems, Diabatix, SkatterBencher, and ElmorLabs led to the development of a groundbreaking pure copper heatsink optimized for liquid nitrogen (LN2) cooling in extreme overclocking scenarios. Based on a design created by Diabatix's generative design ColdStream platform and manufactured by 3D Systems with additive manufacturing, the heatsink achieved a remarkable +60% improvement in heat transfer efficiency compared to traditional heatsinks, establishing a new standard in thermal management for high-performance computing.