Thermal Network Approximation | ColdStream by Diabatix

Finetune your thermal network case setup & thermal resistance

ColdStream analyzes your thermal inputs and automatically builds a lumped-element model to create a thermal network. Each region and boundary is represented by a node, with temperature differences and connectivity deduced from the overall thermal resistance setup.

Using simplified physical models and correlations, thermal network analyses calculate thermal resistance and heat transfer rates quickly, allowing you to get an estimate of the expected cooling performance for your thermal resistance network design in minutes instead of weeks.

Find your optimal heat sink at minimal cost for minimal resistance

ColdStream's advanced correlations enable incredibly fast thermal network calculations to identify the best heat sink.

Forget manual thermal network spreadsheet calculations and their complexities. Solve intractable heat transfer problems with ColdStream's cutting-edge technology from Diabatix.

Schedule a discovery call

Thermal network FAQ’s

What role does thermal resistance play in a thermal network?

Thermal resistance is crucial in a thermal network, defined as the ratio of the temperature difference to the heat flow resistance of a material. It measures a material's ability to resist heat flow and is represented as a thermal resistor in the network. Higher thermal resistance means more difficulty for heat to pass through. Components like heat sinks and thermal interface materials have thermal resistance values used to calculate heat transfer and temperature rise. By analyzing these values, engineers can identify inefficiencies and design solutions, such as using better materials or additional heat sinks, to improve thermal performance.

‍

What are the most common materials used for thermal design, and what are their thermal resistances?

Common materials used in thermal design include:

Copper: Excellent thermal conductor with a conductivity of about 400 W/mK and thermal resistance around 0.02 K/W. Ideal for heat sinks.
Aluminum: Good conductor with 200 W/mK conductivity and around 0.05 K/W resistance. Used in heat sinks.
Thermal Interface Materials (TIMs): Improve thermal transfer between components. Thermal resistance ranges from 0.01 K/W to 0.5 K/W depending on type and thickness.
Silicon: Used in electronics, with conductivity around 150 W/mK and resistance about 0.1 K/W.
Air: An insulator, thermal resistance varies from 0.1 K/W to 1 K/W.

Material selection balances thermal requirements, cost, weight, and durability.

‍

What is thermal conductivity?

Thermal conductivity measures a material's ability to conduct heat, i.e., the rate at which heat energy can be transferred through it by conduction.It is typically measured in watts per meter-kelvin (W/mK).

It represents the amount of heat energy that can be conducted through a material with a given temperature difference over a unit distance.

Materials with high thermal conductivity are able to conduct heat more efficiently than those with low thermal conductivity.

This property is important in design because it helps to determine how easily heat can be transferred from one component to another, or from a component to its surrounding environment.

For example, metals such as copper and aluminum have high thermal conductivity, making them excellent materials for use in heat sinks and other thermal management applications.

Conversely, insulators such as air or thermal interface materials have low conductivity, making them useful for reducing heat transfer between components.

In general, materials with higher conductivity are more desirable in thermal design because they can transfer heat more efficiently, which helps to maintain safe operating temperatures and improve overall system performance.