Sign up for our webinar "Optimizing Power Inverter Cooling with Generative Design" on the 19th of November!Learn More
Hand socket lids are specialized components used primarily in semiconductor testing. Their main function is to securely hold semiconductor devices within test sockets during evaluation and troubleshooting, particularly before transitioning to high-volume manufacturing. These lids ensure a stable and reliable connection for the device under test (DUT), which is crucial for accurate testing results.
Hand socket lids are designed to meet various testing needs. Some models are adjustable to apply precise vertical pressure, which is essential for high-density semiconductor packages. Others may include features like integrated thermal management to dissipate heat generated during testing, ensuring that the DUT remains within operational temperature ranges.
The design of hand socket lids can vary greatly, with options for air or liquid cooling, clip-on mechanisms for easy handling, and even customized designs to meet specific testing requirements.
These tools are critical for ensuring that semiconductor devices perform reliably when subjected to real-world conditions, making them a key part of the semiconductor manufacturing and testing process.
Achieving lower junction temperatures while minimizing the weight of the cooling solutions remains a significant challenge for hand socket lids. TTS Group used ColdStream to explore a variety of advanced heat sink designs to this purpose.
The project aimed to experiment with a range of innovative heat sink geometries, including Lidinoid, Gyroid, SplitP, Circle, Diamond, and Rectangle shapes. Additionally, advanced coldplate and waterblock configurations were explored for liquid cooling applications. Using Coldstream, TTS-Group were able to quickly and effortlessly generate and analyze complex geometries with unprecedented precision. The platform enabled them generate and evaluate hundreds of scenarios in a matter of days, refining their designs iteratively to identify those that offered the best thermal performance.
The results were in the lead engineer’s own words,“fascinating”.
The advanced generative designs not only enhanced thermal management in heatsinks but also achieved lower junction temperatures in semiconductor packages, highlighting the success of using generative thermal designs platforms for better heat sink performances. The platform's capability to handle intricate geometries and optimize designs for thermal performance can open new avenues in thermal management. TTS-group wasexcited about the progress and look forward to further advancements in their work.
TTS Group has been in operation since 1979, specializing in semiconductor test tooling solutions. The company focuses on helping customers address complex challenges in semiconductor testing by providing comprehensive solutions from R&D to validation. TTS Group is committed to innovation, quality, reliability, and on-time delivery, aiming to reduce the total cost of final testing for its customers. The company's vision is to become a leading global provider of semiconductor test tooling solutions.
