Webinar
Date:
April 18, 2024
Duration
30 min

Cooling electronics: Pins, fins, gyroids compared

Exploring TPMS vs. traditional heat sinks in electronics cooling

Summary

The electronics industry is growing rapidly and requires new and innovative techniques for thermal management. One such technique that has gained popularity in 3D-printed heat sinks is Triply Periodic Minimal Surfaces (TPMS), specifically gyroids. In this webinar, the performance of TPMS structures will be compared with conventional heat sink shapes. Through a thorough analysis using CFD and optimization studies, the webinar aims to shed light on the effectiveness of these structures in cooling electronics applications.

Agenda

  • Introduction
  • Challenges in Heat Sink design
  • Design Methodology for Optimization of Heat Sink designs
  • Case Study: Double-Sided Power Inverter
  • Results: Pin-Fin Design vs TPMS Design
  • Questions?
  • Discover ColdStream

Who needs to attend

  • Individuals active in the power electronics industry
  • Designers who are looking to implement innovative new cooling methods like generative design and additive manufacturing
  • Designers with no thermal and/or CFD background looking for user-friendly thermal software
  • Decision makers and team leads looking to maximize efficiency through saving engineering time and material costs

Meet your host

Yogesh Sovani

Ir Yogesh Sovani joined Diabatix in June 2023, with 13 years of experience in Aerospace & Semiconductor industry. During his industrial experience, Yogesh worked on numerous modelling and simulation projects that supported product development. Yogesh also has more than 8 years of experience working in the field of Additive Manufacturing (AM) where he explored topology optimization methods for Design for Additive manufacturing. Currently, as a Sr. Research Engineer, he focuses on core capability development of coldstream for better thermal management.

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