The electronics industry is growing rapidly and requires new and innovative techniques for thermal management. One such technique that has gained popularity in 3D-printed heat sinks is Triply Periodic Minimal Surfaces (TPMS), specifically gyroids. In this webinar, the performance of TPMS structures will be compared with conventional heat sink shapes. Through a thorough analysis using CFD and optimization studies, the webinar aims to shed light on the effectiveness of these structures in cooling electronics applications.

• Introduction
• Challenges in Heat Sink design
• Design Methodology for Optimization of Heat Sink designs
• Case Study: Double-Sided Power Inverter
• Results: Pin-Fin Design vs TPMS Design
• Questions?
• Discover ColdStream

• Individuals active in the power electronics industry
• Designers who are looking to implement innovative new cooling methods like generative design and additive manufacturing
• Designers with no thermal and/or CFD background looking for user-friendly thermal software
• Decision makers and team leads looking to maximize efficiency through saving engineering time and material costs

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