Gain 55% in cooling with DfAM of a copper 3D printed CPU cooler

Sarah da Silva Andrade, Suraj Dinkar Jadhav, Niels Verdijck, Lieven Vervecken


The high conductivity of copper makes it an attractive material for thermal management. However, 3D-printing copper design in laser-based processes is challenging. A custom microchannel design that meets 3D printing manufacturing requirements requires a sophisticated solution. These problems limit the freedom to manufacture and design cooling/thermal management devices. Generative design through topology optimization, taking DfAM (Design for Addictive Manufacturing) rules into account, offers the solution.


  • How to use a generative design to optimize the performance of a CPU cooler with minimal human input or interaction while taking into account the manufacturability
  • A fully three-dimensional solid and fluid domain model and an interface heat transfer model are presented for the CPU cooler modeling.
  • The challenges of a copper 3D printing heatsink and how Amnovis solved it with Laser-Absorptive Cooper Powders
  • A case study demonstrated that the generative CPU cooler heatsink design reveals a 55% improvement in thermal resistance compared to a traditional skived fin heatsink.


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