Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler designs is shorter and shorter. This publication explores the combination of generative design and advanced two-phase cooling simulation techniques to efficiently create two-phase electronics cooling devices.